The 27th edition of the International Interconnect Technology Conference (IITC) will be held June 3-6, 2024 in San Jose, California.

The conference seeks papers on all aspects of BEOL/MOL interconnects and metallization, including design, unit process, integration and reliability, as well as how it applies to 2.5D/3D and heterogenous integration.
Authors are encouraged to submit their original work describing innovative research and development in the critically important field of on-chip interconnects and heterogeneous integration.

IITC is sponsored by the IEEE Electron Devices Society as the premier conference for interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications.