Important IEEE IITC 2020 update. The safety and well-being of conference participants is IEEE’s priority. After studying and evaluating the announcements, guidance, and news released by relevant national departments, we decided IITC 2020 will be held virtually.

IEEE IITC 2020 will occur virtually over 5 days: October 5-9, 2020.
The conference will start with a one-day workshop October 5 entitled “Model Your Way to a Better Backend Technology”, presented by six industry experts from IBM, RPI, ASM, Lam Research, Georgia Tech and imec.
Two keynote talks will occur back-to-back at the start of the main program, October 6.

Mike Mayberry (CTO and Sr. VP/GM of Technology Development, Intel Corporation) will present “The Future of Compute: The Connected World meets the Interconnected Platform.”
H.-S. Philip Wong (VP of Corporate Research at TSMC and the Willard R. and Inez Kerr Bell Professor at Stanford University) will present “Technology for 3D ICs”

The main program includes invited, contributed and poster presentations, occurring October 6-9. These sessions will be a mix of live, pre-recorded and on-demand content. While talks will be pre-recorded, questions and answers will be live.
A revised program is posted on the website. With the new format, registration fees have been significantly reduced, and the entire conference will be available ”on-demand” through October 31.

IITC is sponsored by the IEEE Electron Devices Society as the premier conference for interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications. Authors are encouraged to submit their original work describing innovative research and development in the critically important field of on-chip interconnects, integration and metallization, including design, unit process, integration and reliability.