2025 IITC Conference Program
MONDAY, JUNE 2, 2025
10:30~10:40
Welcome & Introduction
Chairs: Dr. Yasuhiro Kawase(Mitsubishi Chemical Corp.), Prof. Sehun Kwon(Pusan National University)
10:40~11:25
Dr. Jiho Kang, SK hynix
“Semiconductor technology trends to overcome the integration limitations for future AI memory devices”
11:25~12:10
Prof. Tetsu Tanaka, Tohoku University
“Advanced 3DIC/TSV technologies for neuron-machine interface devices”
12:10~13:40
Lunch
13:40~14:25
Dr. Kimin Jun, Samsung Electronics Co., Ltd.
“BSPDN: an interconnect breakthrough powered by bonding technology”
14:25~15:10
Prof. Jyehong Chen, National Yang Ming Chiao Tung University
“The future system prospects of electrical and optical interconnects and their role in AI data centers”
15:10~15:40
Coffee Break
15:40~16:25
Prof. Yung-Jr Hung, National Sun Yat-sen University
“Platform and devices for co-packaged optics”
16:25~17:10
CTO. Shu-Jen Han, Quantum Device
“Building a quantum computer – from device to system”
TUESDAY, JUNE 3, 2025
08:20~08:40
[Session 01 – Conference Kick off and Awards Ceremony]
Chairs: Prof. Kuan-Neng Chen(National Yang Ming Chiao Tung University), Prof. Soo-Hyun Kim(UNIST)
08:40~09:30
[Keynote Talk I] Dr. Jong Myeong Lee, Samsung Electronics Co., Ltd.
“Innovative interconnect technology of future semiconductor”
Chairs: Prof. Kuan-Neng Chen(National Yang Ming Chiao Tung University), Prof. Soo-Hyun Kim(UNIST)
09:30~09:50
Coffee Break
09:50~12:00
[Session 02 – Advanced Interconnects I]
Chairs: Dr. Munehiro Tada(Keio University), Dr. Zsolt Tokei(IMEC)
09:50~10:15
(S02-01)
Invited Dr. Daniel C. Edelstein, IBM
“Innovations enabling the continued extendibility of Cu and Post-Cu damascene BEOL technology”
10:15~10:40
(S02-02)
Invited Dr. Giulio Marti, IMEC
“Advancing pillar-based FSAV integration of Ru interconnect to enlarge the process window and enable multi-layers of high-aspect ratio”
10:40~11:00
(S02-03)
Dr. Giulio Marti, IMEC
“Via resistance optimization at advanced sub-2nm nodes”
Assawer Soussou, Giulio Marti, Zsolt Tokei, Seongho Park, Benjamin Vincent – Lam Research Corporation, IMEC
11:00~11:20
(S02-04)
Mr. Takumi Nishinobo, Tokyo Electron Limited
“Post-Cu CMP leakage suppression using sequential small molecular inhibitor treatment”
Takumi Nishinobo, Kai-Hung Yu, Ryota Yonezawa, Suzuki Hidenao, Aizawa Hirokazu – Tokyo Electron Ltd.
11:20~11:40
(S02-05)
Dr. Kwang Seok Lee, Samsung Electronics Co., Ltd.
“Process integration of high-density low-k dielectric material for enhanced plasma-induced damage resistant performance”
Kwang Seok Lee, Sanghyun Lee, Kyoungpil Park, Gyuho Myeong, Taehwan Jeong, Chin Kim, Doohwan Park, Sihyeong Kim, Taejung Kim, Jeonghoon Ahn, Jongmin Baek, Kang Sub Yim, Kichul Park, Hee Sung Kang – Samsung Electronics Co., Ltd.
11:40~12:00
(S02-06)
Dr. Cassie Sheng, IMEC
“Addressing integration challenges in direct backside contact of CFET”
C. Sheng, S. Demuynck, K. Stiers, A. Peng, C. Toledo de Carvalho Cavalcante, T. Chiarella, A.Vandooren, M. Hosseini, D. Batuk, P. Puttarame Gowda, F. Sebaai, K. Vandersmissen, R. Chukka, L. Di Donato, W.Sun, M. Hasan, A. Weldeslassie, D. Cerbu, N. Jourdan, A. Mingardi, R. Kumar Saroj, S. Kumar Sarkar, S. Iacovo, D. Montero, T. Sarkar, T-H. Shen, J. Bogdanowicz, G. Murdoch., J. Mitard, N. Reddy, I. Gyo Koo, E. Altamirano Sanchez, A-L. Charley, L.P.B. Lima, N. Horiguchi, S. Biesemans – IMEC, Hitachi High-Tech Corporation
12:00~13:10
Lunch
13:10~15:05
[Session 03 – 3D Packaging & Hybrid Bonding I]
Chairs: Prof. Kuan-Neng Chen(National Yang Ming Chiao Tung University), Mr. Tobias Wernicke(EV Group)
13:10~13:35
(S03-01)
Invited Dr. Juheon Yang, SK hynix
“Metal interconnection of high bandwidth memory in wafer level packaging”
13:35~13:55
(S03-02)
Dr. Kisik Choi, IBM
“Predictive simulations and experimental study of AlN bonding for better thermal dissipation in BSPDN”
Sarabjot Singh, Sangshin Jang, Prabudhya R. Chowdhury, Ruilong Xie, Son Nguyen, Yasir Sulehria, Richard Johnson, Michael Belyansky, Juntao Li, Dureseti Chidambarrao, Kang-ill Seo, Kisik Choi – IBM, Samsung Electronics Co., Ltd.
13:55~14:15
(S03-03)
Mr. Abhaysinha Patil, IMEC
“Evaluation of warpage tolerance of 100 µm dies to achieve void-free bond and 100% assembly yield”
Abhaysinha Patil, Koen Kennes, Dieter Cuypers, Bianca Chou, Violeta Georgieva, Samuel Suhard, Arnita Podpod, Alain Phommahaxay, Andy Miller, Yoojin Ban, Filippo Ferraro, Joris Van Campenhout – IMEC
14:15~14:30
(S03-04)*
Mr. Chun-Che Cheng, National Yang Ming Chiao Tung University
“Thermal performance analysis of BSPDN and FSPDN from chip to package level”
Chun-Che Cheng, Mu-Ping Hsu, Chiao-Yen Wang, Li-Hsin Cheng, Kuan-Neng Chen – National Yang Ming Chiao Tung University
14:30~14:45
(S03-05)*
Mr. Hayato Kitagawa, Yokohama National University
“Novel bonding interfacial material for carrier wafer of BSPDN & reconstructed D2W”
Hayato Kitagawa, Taisuke Yamamoto, Jenyu Lee, Shuntaro Machida, Kazuhiro Yuasa, Fumihiro Inoue – Yokohama National University, Kokusai Electric Corporation
14:45~15:05
(S03-06)
Dr. Imene Jadli, IMEC
“Optimizing direct die-to-wafer hybrid bonding: the role of scanner precorrection in achieving fine overlay performance”
Alex Hsu, Imene Jadli, Samuel Suhard, Anne Jourdain, Andy Miller, Amir-Hossein Tamaddon, Koen Kennes, Etienne De Poortere, Victor Blanco – ASML, IMEC
15:05~15:25
Coffee Break
15:25~17:35
[Session 04 – Materials and Unit Process I]
Chairs: Dr. Kang Sub Yim(Samsung Electronics Co., Ltd.), Dr. Marco Arnold(BASF Electronic Materials)
15:25~15:50
(S04-01)
Invited Dr. Jongmin Baek, Samsung Electronics Co., Ltd.
“Selective deposition in interconnect: enabling high-performance and scalable integration”
15:50~16:10
(S04-02)
Dr. Rutvik Mehta, Veeco Instruments Inc.
“Ion beam deposition of ruthenium for interconnect applications in a direct metal etch approach”
Rutvik J Mehta, Gayle Murdoch, Gilles Delie, Jean-Philippe Soulie, A. Sepulveda Marquez, Seongho Park, Zsolt Tokei, Yuejing Wang, Ashish Kulkarni, Robert Walko, Frank Cerio, Robert Caldwell – Veeco Instruments Inc., IMEC
16:10~16:30
(S04-03)
Dr. Fulya Ulu Okudur, IMEC
“UV surface pre-treatment and wet cleaning of Ruthenium MP18 semi-damascene structures”
Fulya Ulu Okudur, Dennis van Dorp, Quoc Toan Le, Tomoya Tanaka, Teppei Nakano, Gilles Delie, Christopher Gort, Hongrui Kang, Benjamin Groven, Thierry Conard, Souvik Kundu, Stefan Decoster, Rita Tilmann, Alexis Franquet, Jan Philipp Hofmann, Gayle Murdoch, Ehsan Shafahian, Naveen Reddy, Efrain Altamirano Sanchez, Chen Wu, Seongho Park, Zsolt Tőkei – IMEC, Screen SPE Germany GmbH, SCREEN Semiconductor Solutions Co., Ltd., Technical University of Darmstadt
16:30~16:45
(S04-04)*
Mr. Yeongjun Lim, KAIST
“Optimizing grain boundary doping in molybdenum interconnects: a first-principle study”
Yeongjun Lim, Mincheol Shin – KAIST
16:45~17:00
(S04-05)*
Ms. Min-Ji Ha, Hanyang University
“Effect of H2/N2 ratio on molybdenum nitride thin films deposited by plasma-enhanced atomic layer deposition”
Min-Ji Ha, Na-Gyeong Kang, Eun-Su Chung, Ji-Hoon Ahn – Hanyang University
17:00~17:15
(S04-06)*
Ms. Chaehyun Park, UNIST
“Atomic layer deposited highly conductive niobium carbide thin films
as next-generation diffusion barriers for Cu and Ru interconnects”
Chaehyun Park, Minjeong Kweon, Debananda Mohapatra, Taehoon Cheon, Jong-Seong Bae, Daeyoon Jeong, Young-Bae Park, Soo-Hyun Kim – UNIST, DGIST, Korea Basic Science Institute, Andong National University
17:15~17:35
(S04-07)
Dr. Geun-Tae Yun, Samsung Electronics Co., Ltd.
“Development of a robust ultra-low-k film and carbon replenishment for reliable BEOL interconnect”
Geun-Tae Yuna, Soohyun Barka, Joohan Kima, Jayeong Heoa, Junsung Kima, Hoon Seok Seoa, Jong Min Baeka, Kang Sub Yima, Sunjung Kima – Samsung Electronics Co., Ltd
WEDNESDAY, JUNE 4, 2025
08:30~09:20
[Session 05 – Keynote Talk Ⅱ] VP. Markus Wimplinger, EV Group
“The role of wafer bonding in next generation interconnect scaling”
Chair: Mr. Tatsuya Usami(Rapidus Corporation)
09:20~10:45
[Session 06 – Advanced Interconnects II]
Chair: Dr. Kisik Choi(IBM)
09:20~09:45
(S06-01)
Invited Dr. Kyoung-Woo Lee, Samsung Electronics Co., Ltd.
“Integration of advanced backside power delivery network for 2nm node technology”
09:45~10:05
(S06-02)
Dr. Gilles Delie, IMEC
“MP16/18 integration in Ru semi-damascene using SiN-based core for spacer-is-dielectric SADP”
Gilles Delie, Stefan Decoster, Chen Wu, Vincent Renaud, Giulio Marti, Souvik Kundu, Yannick Hermans, Fulya Ulu Okudur, Bart Kenens, Nancy Heylen, Gayle Murdoch, Seongho Park, Zsolt Tőkei – IMEC
10:05~10:25
(S06-03)
Dr. Koichi Motoyama, IBM
“First demonstration of 16nm pitch subtractive Ru interconnects for advanced technology nodes”
C. Penny, K. Motoyama, H. Huang, S. Hosadurga, G. Kim, J. Kim, J. Oh, N. Lanzillo, J. Lee, D. Jayachandran, H. Zhang, S. Katakam, H. Singh, G. Oyibo, W-T. Tseng, B. Antonovich, N. Latham, W. Li, C. Yang, S. Munnangi, U. Lamichhane, S. Fan, T. Yamashita, K. Choi, K-I. Seo, D. Guo – IBM, Samsung Electronics Co., Ltd.
10:25~10:45
(S06-04)
Dr. Stéphane Larivière, IMEC
“Electrical test demonstration for 0.55 NA EUV single patterning damascene process”
S. Larivière, V.M. Blanco Carballo, K. Vandersmissen, B. De Wachter, M. Sangghaleh, K. Nafus, Y. Feurprier, Y. Wako, N. Fukui, E. P. De Poortere, C-H. Yao, A. Hsu, C. Tabery, J. Doise, P. De Schepper, N. Guzman – IMEC, Tokyo Electron Ltd., ASML, JSR Corporation, Intel Corporation
10:45~11:05
Coffee Break
11:05~12:30
[Session 07 – Reliability and Characterization]
Chair: Dr. Benjamin Lilienthal-Uhlig(Fraunhofer IPMS/CNT)
11:05~11:30
(S07-01)
Invited Dr. Bettina Wehring, Fraunhofer IPMS
“Advanced XPS depth profiling analysis of metal alloys as diffusion barriers for Cu interconnects”
11:30~11:50
(S07-02)
Ms. Youqi Ding, IMEC
“Quantifying the impact of thermal gradients on electromigration lifetimes in 90 nm CD Cu Lines”
Y. Ding, O. Varela Pedreira, M. Lofrano, H. Zahedmanesh, J. Diaz Fortuny, X. Chang, T. Chavez, H. Farr, I. De Wolf, K. Croes – KU Leuven, IMEC, QualiTau Inc
11:50~12:10
(S07-03)
Mr. Ahmed Saleh, IMEC
“AI-driven variability-aware physics-based EM simulation framework for Jmax estimation”
A. S. Saleh, K. Croes, H. Ceric, I. De Wolf, H. Zahedmanesh – IMEC, Vienna University of Technology
12:10~12:30
(S07-04)
Dr. Jit Dutta, University of California San Diego
“Nanoscale assesment of capping layers to prevent surface oxidation of W interconnect plugs”
Jit Dutta, Ping-Che Lee, Dipayan Pal, Wei Zhang, Nathan Jarnagin, Larissa Juschkin, Evgeniia Butaeva, Roel Gronheid, Andrew C. Kummel – University of California San Diego, KLA Corporation
12:30~13:40
Lunch
13:40~15:35
[Session 08 – Materials and Unit Process II]
Chairs: Prof. Soo-Hyun Kim(UNIST), Prof. Andrew Kummel(University of California San Diego)
13:40~14:05
(S08-01)
Invited Prof. Il-Kwon Oh, Ajou University
“Unconventional reduction in resistivity of atomic scale topological semimetal of NbP and TaP”
14:05~14:25
(S08-02)
Dr. Takayuki Harada, National Institute for Materials Science
“Low-resistivity PdCoO2 thin films with rigid interlayer bonds for advanced interconnects”
Takayuki Harada, Yuka Iwai, Midori Abe, Takuro Nagai, Yasushi Masahiro, Yasunori Kama – National Institute for Materials Science, TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd.
14:25~14:45
(S08-03)
Dr. Keun Wook Shin, Samsung Advanced Institute of Technology
“Epitaxial growth and resistivity characterization of Rhodium thin films for advanced interconnect applications”
Keun Wook Shin, Gi-Young Jo, Eunji Yang, Jeong Yub Lee – Samsung Advanced Institute of Technology
14:45~15:00
(S08-04)*
Mr. Masaya Iwabuchi, Tohoku University
“Evaluation of intermetallic compounds selected From DFT database”
Masaya Iwabuchi, Junichi Koike – Tohoku University
15:00~15:20
(S08-05)
Dr. Sunyoung Noh, Samsung Electronics Co., Ltd.
“The intermixing study of Cu/Ru interface in dual-damascene scheme for advanced interconnect”
Sunyoung Noh, Yeonuk Kim, Seongho Park, Olalla Varela Pedreira, Nunzio Buccheri, Myungho Kong, Hana Kim, Marleen H. van der Veen, Eunji Jung, Jungpyo Hong, Juhyun Kim, Zsolt Tőkei, Rak-Hwan Kim, Seung Hun Lee, Sangjin Hyun, Jaihyuk Song – Samsung Electronics Co., Ltd., IMEC
15:20~15:35
(S08-06)*
Ms. Jeongha Kim, UNIST
“Improved properties of atomic layer deposited Ru films by providing additional reactant
for Cu alternative nanoscale interconnects”
Jeongha Kim, Debananda Mohapatra, Yeseul Son, Jae Min Jang, Sang Bok Kim, Taehoon Cheon, Boggeun Shong, Soo-Hyun Kim – UNIST, Hongik University, DGIST
15:35~15:55
Coffee Break
15:55~17:20
[Session 09 – Advanced Interconnects III]
Chair: Dr. Mansour Moinpour(Merck)
15:55~16:20
(S09-01)
Invited Dr. Koichi Motoyama, IBM
“Reliability and performance enhancement for fully subtractive Ru Topvia interconnects”
16:20~16:40
(S09-02)
Dr. Peng Zhao, IMEC
“Integration of through-dielectric-via on buried power rail and slit nano through-silicon-via for enhanced backside connectivity”
P. Zhao, L. Witters, M. Stucchi, D. Montero, N. Vergel, V. Georgieva, B. Chou, K. Devriendt, N. Jourdan, J.W. Maes, C. Zhu, H. Bana, R. Chukka, F. Sebaai, B. Kenens, K. Vandersmissen, N. Heylen, S. Sarkar, F. Schleicher, J. De Vos, G. Beyer, E. Beyne – IMEC, ASM International, KLA Corporation
16:40~17:00
(S09-03)
Dr. Taeyeon Oh, Lam Research
“Pathfinding for Molybdenum Hybrid Metallization”
TaeYeon Oh, Ivan Chakarov, Gonzalo Feijoo, Andras Pap, Kitae Kim, Daniel Faken, Mike Simmermacher, Sandy Wen, Benjamin Vincent, Joseph Ervin – Lam Research
17:00~17:20
(S09-04)
Dr. Chen Wu, IMEC
“Two-metal-level semi-damascene interconnect with variable width bottom metal
at metal pitch 18-26 nm and aspect ratio 4-6 routed using fully self-aligned via”
Anshul Gupta, Chen Wu, Vincent Renaud, Olalla Varela Pedreira, Alicja Lesniewska, Souvik Kundu, Giulio Marti, Gilles Delie, Fulya Ulu Okudur, Yannick Hermans, Stefan Decoster, Davide Tierno, Evi Vrancken, Bart Kenens, Naveen Reddy, Gayle Mudoch, Seongho Park, and Zsolt Tokei – IMEC
fce4d6″>17:20~18:30
fce4d6″>Poster Session
Chairs: Prof. Sehun Kwon(Pusan National University), Prof. Jeonghwan Han(Seoul National University of Science and Technology),
Dr. Tae-Ik Lee(KITECH)
18:30~20:30
Banquet
THURSDAY, JUNE 5, 2025
08:30~09:20
[Session 10 – Keynote Talk Ⅲ] VP. Kaihan Ashtiani, Lam Research
“Interconnect scaling – materials, processes and integration challenges and solutions”
Chair: Prof. Soo-Hyun Kim(UNIST)
09:20~10:30
[Session 11 – Advanced Interconnects IV]
Chair: Dr. Christopher J. Wilson(IMEC)
09:20~09:45
(S11-01)
Invited Dr. Fabrice Nemouchi, CEA Leti
“Towards 300mm superconducting devices : from FDSOI transistors to gatemon qubits”
09:45~10:10
(S11-02)
Invited Mr. Blake Hodges, IMEC
“Optimized two metal level semi-damascene interconnects for superconducting digital logic”
10:10~10:30
(S11-03)
Dr. David Mandia, Lam Research
“Selective and superconformal molybdenum growth strategies for advanced metallization”
David Mandia, Matthew Griffiths, Lee Brogan, Arya Shafiefarhood, JenniferO’Loughlin, Justin Kim, Nick De Marco, Youness Alvandi, Kyle Blakeney – Lam Research
10:30~10:50
Coffee Break
10:50~12:20
[Session 12 – BEOL Integration and Characterization]
Chairs: Mr. Tom Mountsier(Lam Research), Mr. Tatsuya Usami(Rapidus Corporation)
10:50~11:15
(S12-01)
Invited Dr. Larissa Juschkin, KLA Corporation
“High speed optical inspection of wafers”
11:15~11:40
(S12-02)
Invited Dr. Nicolas Posseme, CEA-Leti
“Benefit of post etch treatment for defectivity improvement in the BEOL”
11:40~12:00
(S12-03)
Dr. Yannick Hermans, IMEC
“Robust overlay control in 2-level semi-damascene”
Yannick Hermans, Giulio Marti, Vincent Renaud, Gilles Delie, Souvik Kundu, Stefan Decoster, Matt Galagher, Anshul Gupta, Bart Kenens, Fulya Ulu okudur, Gayle Murdoch, Andrea Mingardi, Sandip Halder, Chen Wu, Seongho Park, Zsolt Tőkei – IMEC
12:00~12:20
(S12-04)
Prof. Houman Zahedmanesh, IMEC
“Thermally-induced morphology changes in subtractive Ru lines and their mitigation”
Houman Zahedmanesh, Gilles Delie, Asif A. Shah, Hajdin Ceric, Mayank Shrivastava, Seongho Park, Zsolt Tokei – IMEC, Faculty of Engineering Science KU Leuven, Indian Institute of Science, Vienna University of Technology
12:20~13:30
Lunch
13:30~14:45
[Session 13 – 3D Packaging & Hybrid Bonding II]
Chairs: Dr. Cheng-Hsien Lu(Macronix), VP. Hoyoung Son(SK hynix)
13:30~13:50
(S13-01)
Mr. Yinan Lu, Applied Materials
“Hybrid bonding: die to wafer dynamic process investigation through advanced 3D modeling”
Yinan Lu, Benedikt Pressl, Ke Zheng, Liu Jiang, Hannes Kostner, Chris Scanlan, Raymond Hung, El Mehdi Bazizi – Applied Material, Besi
13:50~14:10
(S13-02)
Mr. SeokHo Na, Amkor Technology
“Advanced interconnection technology overview”
SeokHo Na, GaHyeon Kim, DongHyeon Park, DongSu Ryu, DongJoo Park, KyungRok Park – Amkor Technology
14:10~14:30
(S13-03)
Dr. Takeki Ninomiya, The University of Tokyo
“Aluminum nitride interlayer dielectric integration for effective heat dissipation of 3D-IC”
Takeki Ninomiya, Takeshi Takagi, Eiji Komatsu, Satoshi Yoshida, Masaaki Niwa, Tadahiro Kuroda – The University of Tokyo, Shinko Seiki Co., Ltd.
14:30~14:45
(S13-04)*
Ms. Jia-Rui Lin, National Yang Ming Chiao Tung University
“Low-temperature epoxy-based Cu/Polymer hybrid bonding for 3D IC packaging with optimized CMP”
Jia-Rui Lin, Yi-Hsuan Chen, Yuan-Chiu Huang, Jumpei Fujikata, Keiko Abe, Naoko Araki, Takayuki Ohba, Kuan-Neng Chen – National Yang Ming Chiao Tung University, Ebara Corporation, Daicel Corporation, Institute of Science Tokyo
14:45~15:00
Closing Ceremony
POSTER SESSION
Poster Session Chairs: Sehun Kwon(Pusan National University), Junghwan Han(Seoul National University of Science and Technology), Tae-Ik Lee(KITECH)
*: student presentation