CALL FOR PAPERS

The 23rd edition of the International Interconnect Technology Conference (IITC) will be held June 1-4, 2020 in San Jose, California. Authors are encouraged to submit their original work describing innovative research and development in the critically important field of on-chip interconnects. The conference seeks papers on all aspects of BEOL/MOL interconnects and metallization, including design, unit process, integration and reliability. The deadline for submission of abstracts is January 31, 2020.

IITC is sponsored by the IEEE Electron Devices Society as the premier conference for interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications. The conference seeks papers on all aspects of BEOL/MOL interconnects and metallization, including design, unit process, integration and reliability.

Applications of Interest

  • Advanced interconnect metallizations with low-k dielectrics as well as optical, wireless, and carbon-based interconnects, beyond Cu…
  • Contacts on MOS devices: Silicide, III-V, 2D materials…
  • Memory architecture: CBRAM, PCRAM, ReRAM, MRAM, DRAM, 3DNAND…
  • 3D integration & packaging concerns: WtW/CtW bonding, Interposer, Through Si Via, CPI…
  • Novel System and Emerging Technology: Energy harvesting, brain-inspired computing…
  • Novel Form Factors: flexible electronics, wearables…

Topics of Interest

  • Process integration, via/trench patterning
  • Materials and Unit Processes (Dielectrics, Metals, barriers, Wet, CMP, PVD, CVD, patterning)
  • Reliability and Failure analysis, techniques and methods
  • Advanced material/process characterization, design-technology co-optimization, and modelling techniques

Abstract Information
Abstracts must be no more than 3 pages in length. Details of abstract submission, including a template can be found on the web site. Submissions will be reviewed for acceptance as oral presentation or poster. Accepted abstracts will be published digitally by IEEE as IITC Conference Proceedings without further changes.