NORTH AMERICA IITC COMMITTEE
General Chair:
Zhihong Chen, Purdue
Program Chair
Mansour Moinpour, EMD
Program Co-Chair
Nick Lanzillo, IBM
Workshop Chair
Kisik Choi, IBM
Treasurer
John Zhu, Qualcomm
Assistant Treasurer
Mark Zaleski, Micron
Supplier Relations
Tom Mountsier, LRC
Publicity Chair
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Honorary Chair
Paul Besser, Entegris
Past Chair
Hui Jae Yoo, Applied Materials
Technical Committee
- Kathleen Dunn, SUNY Polytechnic
- Mark Kellam, Rambus
- Hirokazu Aizawa, TEL
- Mehul Naik, Applied Materials
- Todd Ryan, Intel
- Glen Wilk, ASM
- Atul Madhavan, Intel
- Andrew Kummel, UCSD
- Harsono Simka, Samsung
- Arup Saha, ASML
ASIA IITC COMMITTEE
General Chair
Tatsuya Usami, Rapidus Corporation
Program Chair
Kuan-Neng Chen, National Yang Ming Chiao Tung Universit
Program Co-Chair
Soo-Hyun Kim, Ulsan National Institute of Science and Technology (UNIST)
Workshop Chair
Yasuhiro Kawase, Mitsubishi Chemical Corp.
Supplier Relations
Hiroyuki Nagai, Tokyo Electron Ltd.
Publicity Co-Chair
Susumu Matsumoto, Tower Partners Semiconductor Co.
Members
- Yoshihisa Kagawa, Sony Corp
- Chih-Chien Liu, UMC
- Kazumichi Tsumura, Toshiba Corp
- Ming-Han Lee, TSMC
- Choon-Hwan Kim, SK Hynix Semiconductor
- Yeow Kheng Lim, National University of Singapore
- Masayoshi Tagami, Kioxia Corp.
- Fumihiro Inoue, Yokohama National University
- Munehiro Tada, Nanobridge Semiconductor, Inc.
- Jeong Hoon Ahn, Samsung Electronics Co.
- Tan Tam Lyn, Global Foundries
- Hisashi Kino, Kyushu University
- Kang Sub Yim, Samsung Electronics Co.
- Woong Sun Lee, SK Hynix Semiconductor
EU IITC COMMITTEE
General Chair
Philippe Rodriguez, CEA Leti
Program Chair
Zsolt Tokei, Imec
Workshop Chair
Benjamin Lilienthal-Uhlig, Fraunhofer IPMS/CNT
Supplier Relations
Pieter Wöltgens, ASML
Supplier Relations
Marco Arnold, BASF Electronic Materials
Members
- Stefan Schulz, TU Chemnitz
- Axel Preusse, GLOBALFOUNDRIES
- Jean-Marc Girard, Air Liquide Electronics
- Tobias Herzig, Infineon