NA IITC COMMITTEE

Conference General Chair:

Hui Jae Yoo, Applied Materials

Program Chair

Zhihong Chen, Purdue

Treasurer

John Zhu, Qualcomm

Workshop Chair

Nick Lanzillo, IBM

Supplier Relations

Mansour Moinpour, EMD

Members

Sanjeev Aggarwal, Everspin
Hirokazu Aizawa, TEL
Paul Besser, Entegris
Kisik Choi, IBM
Kathleen Dunn, Suny Polytechnic Institute
Daniel Gall, Rensselaer Polytechnic Institute
Mark Kellam, Rambus
Mehul Naik, Applied Materials
Todd Ryan, Intel
Glen Wilk, ASM
Xiaopeng Xu, Synopsis
Andrew Yeoh, Applied Materials
Mark Zaleski, Micron

ASIA IITC COMMITTEE

General Chair

Kuan-Neng Chen, National Yang Ming Chiao Tung University

Program Chair

Soo-Hyun Kim, Yeungnam University

Program Co-Chair

Tatsuya Usami, ASM Japan

Workshop Co-Chair

Yasuhiro Kawase, Mitsubishi Chemical Corp.

Supplier Relations

Hiroyuki Nagai, Tokyo Electron Ltd.

Publicity Co-Chair

Susumu Matsumoto, Tower Partners Semiconductor Co.

Members

Yoshihisa Kagawa, Sony Semiconductor Solutions Corp.
Chih-Chien Liu, UMC
Kazumichi Tsumura, Toshiba Corp,
Ming-Han Lee, TSMC
Chee Lip Gan, Nanyang Technological University
Rak-Hwan Kim, Samsung Electronics Co.
Tetsu Tanaka, Tohoku University
Choon-Hwan Kim, Hynix Semiconductor
Yeow Kheng Lim, National University of Singapore
Sang Hoon Ahn, Samsung Electronics Co.
Masayoshi Tagami, Kioxia Corp.
Munehiro Tada, Nanobridge Semiconductor
Fumihiro Inoue, Yokohama National University

EU IITC COMMITTEE

General Chair

Stefan Schulz, TU-Chemnitz

Program Chair

Axel Preusse, GLOBALFOUNDRIES

Program Co-Chair

Robert Socha, ASML

Supplier Relations

Luke Henderson, BASF Electronic Materials

Publicity Co-Chair

Christopher J. Wilson, Imec

Members

Zsolt Tokei, Imec
Philippe Rodriguez, CEA Leti
Jean-Marc Girard, Air Liquide Electronics
Claire van Lare, ASML
Benjamin Lilienthal-Uhlig, FhG IPMS/CNT