EXECUTIVE COMMITTEE
Conference General Chairs:
Paul Besser, Arm
Robert Socha, ASML
Soo-Hyun Kim, Yeungnam University
Program Chairs
Larry Zhao, Applied Materials
Stefan Schulz, TU-Chemnitz
Kazuyoshi Ueno, Shibaura Institute of Technology
Program Co-Chairs
Hui Jae Yoo, Intel
Axel Preusse, GLOBALFOUNDRIES
Kuan-Neng Chen, National Chiao Tung University
Treasurer
Terry Spooner, IBM
Workshop Chairs
Zhihong Chen, Purdue University
Supplier Relations
Glen Wilk, ASM
Luke Henderson, BASF Electronic Materials
Hiroyuki Nagai, Tokyo Electron Ltd.
PROGRAM COMMITTEE
NORTH AMERICA
Sanjeev Aggarwal, Everspin
Paul Besser, ARM
Zhihong Chen, Purdue University
Dan Edelstein IBM
Ming Li, Rambus
Mehul Naik, Applied Materials
Kaoru Maekawa, Tokyo Electron Ltd.
Mansour Moinpour,EMD Performance Materials
Todd Ryan, Intel
Terry Spooner, IBM
Valeriy Sukharev, Mentor Graphics
Glen Wilk, ASM
Andrew Yeoh, Applied Materials
Hui Jae Yoo, Intel
Xiaopeng Xu, Synopsys
Mark Zaleski, Micron
Larry Zhao, Applied Materials
John Zhu, Qualcomm
ASIA
Kuan-Neng Chen, National Chiao Tung University
Kazumichi Tsumura, Toshiba Corp
Chee Lip Gan, Nanyang Technological University
Yoshihisa Kagawa, Sony Corp
Rak-Hwan Kim, Samsung Electronics Co.
Choon-Hwan Kim, Hynix Semiconductor
Soo-Hyun Kim, Yeungnam University
Takahiro Kouno, Socionext
Ming-Han Lee, TSMC
Yeow Kheng Lim, STATS ChipPac
Yasuhiro Kawase, Mitsubishi Chemical
Chih-Chien Liu, UMC
Susumu Matsumoto, Tower Partners Semiconductor Co., Ltd
Tatsuya Usami, Renesas Electronics
Tetsu Tanaka Tohoku University
Kazuyoshi Ueno, Shibaura Institute of Technology
EUROPE
Jean-Marc Girard, Air Liquide Electronics
Luke Henderson, BASF Electronic Materials
Gregory Imbert, STMicroelectronics
Laurens Kwakman, FEI
Claire van Lare, ASML
Romy Liske, GLOBALFOUNDRIES
Axel Preusse, GLOBALFOUNDRIES
Stefan Schulz, TU-Chemnitz
Robert Socha, ASML
Zsolt Tokei, imec
Christopher Wilson, imec