EXECUTIVE COMMITTEE

Conference General Chairs:

Paul Besser, Arm
Robert Socha, ASML
Soo-Hyun Kim, Yeungnam University

Program Chairs

Larry Zhao, Lam
Stefan Schulz, TU-Chemnitz
Kazuyoshi Ueno, Shibaura Institute of Technology

Program Co-Chairs

Hui Jae Yoo, Intel
Axel Preusse, GLOBALFOUNDRIES
Kuan-Neng Chen, National Chiao Tung University

Treasurer

Terry Spooner, IBM

Workshop Chairs

Zhihong Chen, Purdue University

Supplier Relations

Glen Wilk, ASM
Luke Henderson, BASF Electronic Materials
Hiroyuki Nagai, Tokyo Electron Ltd.​

PROGRAM COMMITTEE

​NORTH AMERICA

Sanjeev Aggarwal, Everspin
Paul Besser, ARM
Zhihong Chen, Purdue University
Dan Edelstein IBM
Ming Li, Rambus
Mehul Naik, Applied Materials
Kaoru Maekawa, Tokyo Electron Ltd.
Mansour Moinpour,Merck
Todd Ryan, Intel

Terry Spooner, IBM
Valeriy Sukharev, Mentor Graphics
Glen Wilk, ASM
Andrew Yeoh, Intel
Hui Jae Yoo, Intel
Xiaopeng Xu,  Synopsis
Mark Zaleski, Micron
Larry Zhao, Lam Research
John Zhu, Qualcomm

ASIA

Kuan-Neng Chen, National Chiao Tung University
Kazumichi Tsumura, Toshiba Corp
Chee Lip Gan, Nanyang Technological University
​Yoshihisa Kagawa, Sony Corp
Rak-Hwan Kim, Samsung Electronics Co.
Choon-Hwan Kim, Hynix Semiconductor
Soo-Hyun Kim, Yeungnam University
Takahiro Kouno, Socionext

Ming-Han Lee, TSMC
Yeow Kheng Lim, STATS ChipPac
Yasuhiro Kawase, Mitsubishi Chemical
Chih-Chien Liu, UMC
Susumu Matsumoto, Towerjazz Panasonic Semiconductor Co.
Tatsuya Usami, Renesas Electronics
Tetsu Tanaka Tohoku University
Kazuyoshi Ueno, Shibaura Institute of Technology

​EUROPE

Jean-Marc Girard, Air Liquide Electronics
Luke Henderson, BASF Electronic Materials
Gregory Imbert, STMicroelectronics
Laurens Kwakman, FEI
Claire van Lare, ASML
Romy Liske, GLOBALFOUNDRIES
Sylvain Maitrejean, CEA-Leti
Axel Preusse, GLOBALFOUNDRIES
Stefan Schulz, TU-Chemnitz
Robert Socha, ASML
Zsolt Tokei, imec
Christopher Wilson, imec