NA IITC COMMITTEE
Conference General Chair:
Hui Jae Yoo, Applied Materials
Program Chair
Zhihong Chen, Purdue
Treasurer
John Zhu, Qualcomm
Workshop Chair
Nick Lanzillo, IBM
Supplier Relations
Mansour Moinpour, EMD
Publicity
Tom Mountsier, Lam Research
Past Chair
Paul Besser, Entegris
Members
ASIA IITC COMMITTEE
General Chair
Kuan-Neng Chen, National Yang Ming Chiao Tung University
Program Chair
Soo-Hyun Kim, Yeungnam University
Program Co-Chair
Tatsuya Usami, ASM Japan
Workshop Co-Chair
Yasuhiro Kawase, Mitsubishi Chemical Corp.
Supplier Relations
Hiroyuki Nagai, Tokyo Electron Ltd.
Publicity Co-Chair
Susumu Matsumoto, Tower Partners Semiconductor Co.
Members
Chih-Chien Liu, UMC
Kazumichi Tsumura, Toshiba Corp,
Ming-Han Lee, TSMC
Chee Lip Gan, Nanyang Technological University
Rak-Hwan Kim, Samsung Electronics Co.
Tetsu Tanaka, Tohoku University
Choon-Hwan Kim, SK Hynix Semiconductor
Yeow Kheng Lim, National University of Singapore
Sang Hoon Ahn, Samsung Electronics Co.
Masayoshi Tagami, Kioxia Corp.
Munehiro Tada, Nanobridge Semiconductor
Fumihiro Inoue, Yokohama National University
EU IITC COMMITTEE
General Chair
Stefan Schulz, TU-Chemnitz
Program Chair
Axel Preusse, GLOBALFOUNDRIES
Program Co-Chair
Robert Socha, ASML
Supplier Relations
Luke Henderson, BASF Electronic Materials
Publicity Co-Chair
Christopher J. Wilson, Imec
Members
Philippe Rodriguez, CEA Leti
Jean-Marc Girard, Air Liquide Electronics
Claire van Lare, ASML
Benjamin Lilienthal-Uhlig, FhG IPMS/CNT