Invited Speakers

Invited Speaker NameInvited Talk Topic
Jeong-Hoon Ahn

Samsung
7 nm BEOL Integration and Qualification for Manufacturing
Kristof Croes

imec
Interconnect Reliability
Suman Datta
University of Notre Dame
BEOL device technology and integration for denser function
Regina Freed


Applied Materials
Selective processing to improve self alignment
Arnaud Furnemont

imec
Memory technologies
Oleg Gluschenkov
IBM
MOL/BEOL Intersection for Advanced CMOS Nodes
Chris H. Kim

University of Minnesota
Characterization and Mitigation of Electromigration Effects in Advanced Technology Nodes
Eiich Kondoh

University of Yamanashi
Novel System and Emerging Technology
Nick Lanzillo
IBM
A Comprehensive BEOL Performance Extraction Methodology
Takeshi Nogami
IBM
Advanced Interconnects
Jon Reid
Lam Research
ECP Deposition and characterization of Co and/or Cu
Harsono Simka
Samsung
Design technology co-optimization for interconnect performance/scaling
Shintaro Yamamichi
IBM Japan
3D/2.5D Integration