Marvell Technology
Intel Corp.
Applied Materials
Myung-Hee Na is the Vice President and General Manager of Technology Research and Technology Systems at Intel. Over the past 20 years, she has established herself as a leading semiconductor technologist, holding executive roles across the U.S., Belgium, and Korea. Her expertise spans the full semiconductor stack—from devices to design—covering both logic and memory technologies.
Before joining Intel in April 2024, she served as Vice President of the Revolutionary Technology Center at SK Hynix, where she led long-term research roadmaps and strategies in memorycentric and emerging computing domains. From 2019 to 2023, she was Vice President of Technology Solutions and Enablement at imec in Belgium, guiding 10year research strategies for CMOS pathfinding and nextgeneration computing.
Dr. Na began her career at IBM in 2001 after completing her Ph.D. in Physics. During her tenure, she advanced through a range of technical, managerial, and executive roles and was promoted to Distinguished Engineer and Technical Executive. At IBM Research, she led R&D for several generations of semiconductor technologies—including highK metal gate, FinFET, and nanosheet architectures—and contributed extensively through research publications and international patents.
Dr. Hamid Azimi
Senior Vice President, Advanced Packaging and Foundry
Dr. Hamid R. Azimi is Senior Vice President of Advanced Packaging and Foundry at Marvell. In this role, he leads the development and deployment of next-generation packaging technologies and foundry strategies to support Marvell’s data infrastructure products.
Prior to joining Marvell, Hamid spent nearly 30 years at Intel, where he most recently served as Corporate Vice President and Director of Substrate Packaging Technology Development. He led global R&D and manufacturing teams and delivered industry-leading innovations including die-embedded panel level fanout, EMIB and glass packaging for AI and high-performance computing.
A recognized pioneer in semiconductor packaging, Hamid holds over 40 U.S. patents, including the patent on first-generation organic flip-chip ABF-based substrate. He has received multiple Intel Achievement Awards and is widely known for building high-performing, inclusive teams and mentoring future industry leaders.
Hamid earned a Ph.D. and M.S. in Materials Science from Lehigh University and a B.S. in Materials Engineering from Sharif University of Technology.
Dr. Mukund Srinivasan is the Group Vice President and General Manager of the Technology Solutions Group at Applied Materials. His responsibilities include managing the Heterogeneous Integration Business Unit (HI), Integrated Materials Solutions (IMS), Applied’s Actionable Insight Accelerator (AIx),
Disruptive Technology Group and the EPIC platform. These teams work closely with leading logic, memory and advanced packaging customers in developing technology solutions to accelerate customer’s device roadmaps.
Mukund most recently served as General Manager of the Integrated Materials Solutions and Etch Business Units, and previously the CVD/ALD Business Unit.
Prior to joining Applied in 2013, Mukund spent 16 years at Lam Research in different positions, including General Manager for the Clean Product Group and leadership positions in Etch.
He holds a Ph.D. in mechanical engineering from the University of California, Berkeley.
