Workshop Invited Speakers

KJ Cho, University of Texas at Dallas
Nanophononics Interlayer Design of Heterostructure Thermal Boundary Resistance

Satish Kumar, – Georgia Tech
Machine Learning-Enabled Fast and Accurate Prediction of Thermal Properties via Thermo-Reflectance based Metrology

Vladimir Noveski, – Micron
Thermal challenges in HBM packaging

Stanley C Song, – Google
Managing the Heat: Overcoming Thermal Bottlenecks in Backside Power Delivery

Alfredo Bismuto, – META
Design Considerations for Optimum Thermal Performance in AR/VR Applications