Myung-Hee Na is the Vice President and General Manager of Technology Research and Technology Systems at Intel. Over the past 20 years, she has established herself as a leading semiconductor technologist, holding executive roles across the U.S., Belgium, and Korea. Her expertise spans the full semiconductor stack—from devices to design—covering both logic and memory technologies.
Before joining Intel in April 2024, she served as Vice President of the Revolutionary Technology Center at SK Hynix, where she led long-term research roadmaps and strategies in memorycentric and emerging computing domains. From 2019 to 2023, she was Vice President of Technology Solutions and Enablement at imec in Belgium, guiding 10year research strategies for CMOS pathfinding and nextgeneration computing.
Dr. Na began her career at IBM in 2001 after completing her Ph.D. in Physics. During her tenure, she advanced through a range of technical, managerial, and executive roles and was promoted to Distinguished Engineer and Technical Executive. At IBM Research, she led R&D for several generations of semiconductor technologies—including highK metal gate, FinFET, and nanosheet architectures—and contributed extensively through research publications and international patents.
Mayank Mayukh is a Senior Distinguished Engineer at Marvell, where he leads the exploration and incubation of next‑generation packaging technologies that will define computing platforms 3–5 years into the future. His work sits at the intersection of materials, devices, packaging, and systems, shaping how heterogeneous integration, power delivery, thermal solutions, and advanced substrates come together to enable the next wave of high‑performance and AI‑driven computing systems.
Prior to Marvell, Mayank held technical roles at Broadcom and Intel, where he contributed to the advancement of electronic and photonic heterogeneous integration across silicon, packaging, and interconnect technologies. Across these roles, he has consistently worked at the frontier, where new materials, new architectures, and new manufacturing paradigms converge. He is a named inventor on multiple U.S. patents spanning heterogeneous integration, signal and power integrity, and advanced packaging technologies.
His career is shaped by a deep multidisciplinary foundation, with expertise spanning photovoltaic devices, organic electronics, and advanced semiconductor packaging, and academic roots at the Indian Institute of Technology, Delhi, the University of Arizona, and the University of Chicago.
Driven by the belief that packaging is the new system architecture, Mayank focuses on redefining how chips are integrated, powered, cooled, and interconnected, transforming packaging from an enabling technology into a primary lever for performance, efficiency, and scalability in future computing systems.
Dr. Mukund Srinivasan is the Group Vice President and General Manager of the Technology Solutions Group at Applied Materials. His responsibilities include managing the Heterogeneous Integration Business Unit (HI), Integrated Materials Solutions (IMS), Applied’s Actionable Insight Accelerator (AIx),
Disruptive Technology Group and the EPIC platform. These teams work closely with leading logic, memory and advanced packaging customers in developing technology solutions to accelerate customer’s device roadmaps.
Mukund most recently served as General Manager of the Integrated Materials Solutions and Etch Business Units, and previously the CVD/ALD Business Unit.
Prior to joining Applied in 2013, Mukund spent 16 years at Lam Research in different positions, including General Manager for the Clean Product Group and leadership positions in Etch.
He holds a Ph.D. in mechanical engineering from the University of California, Berkeley.
